摘要 |
<p>The module (1) has contact units (5a, 5b) for electrically contacting a power semiconductor component (6). A plunger (9), a counter bearing plate (10), a cup spring (11), a pan head screw (12) and a bolt (17) bias the contact units against the power semiconductor component for electrical contact and to bias the power semiconductor component against a cooling body for thermal contact through a heat conducting body (3) made of copper. A plate (2) with an aperture (13) is partly arranged with the heat conducting body. The power semiconductor component is selected from one of a silicon-steered rectifier (SCR), output regulator, power transistor, insulating gate bipolar transistor, MOSFET, power rectifier, a diode such as Schottky diode, junction-FET, and thyristor such as gate turn off thyristor, a gate communicated thyristor, a TRIAC, a DIAC and photo thyristor. An independent claim is also included for a method for assembling a power semiconductor module for fastening at a cooling body.</p> |