RESIN COMPOSITION FOR THERMAL CONDUCTIVITY SHEET, THERMAL CONDUCTIVITY SHEET, AND POWER MODULE

摘要

PROBLEM TO BE SOLVED: To provide a resin composition for a thermal conductivity sheet, which can control curing reaction without being affected by the amount of impurities contained in boron nitride and can provide the thermal conductivity sheet excellent in adhesiveness to a heat-dissipating member as well as in thermal conductivity and electric insulation properties.

SOLUTION: The resin composition for thermal conductivity sheet includes a thermosetting resin and secondary sintered particles of the boron nitride. In the resin composition, nano particles of an amphoteric oxide is contained so that pH of extracted water obtained 72 hours after the thermal conductivity sheet is subjected to pressure cooker test at 121°C is 6.5 to 8.5.

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