| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a power conversion apparatus capable of ensuring cooling performance with a simple structure without using a plurality of coolers. <P>SOLUTION: A power conversion apparatus comprises: a cooler 101; a semiconductor 104 arranged on a main surface 103 of the cooler 101; a radiator 105 having a U-shaped cross section contacting with a surface opposed to a surface of the semiconductor 104 contacting with the cooler 101, and covering the semiconductor 104; a cover member 108 of the cooler 101 covering the main surface 103 of the cooler 101; and a spring member 109 provided between the cover member 108 and the radiator 105, and applying biasing force Fa in the direction of bringing the radiator 105 and the semiconductor 104 into contact with each other. The power conversion apparatus further comprises an elastic member 110 which partially contacts with ends of the cooler 101 and the radiator 105. <P>COPYRIGHT: (C)2013,JPO&INPIT |
