发明名称 INSULATION HEAT RADIATION FILM AND METHOD FOR PRODUCING THE SAME
摘要 <P>PROBLEM TO BE SOLVED: To provide an insulation heat radiation film capable of improving thermal conductivity with even a small amount of an inorganic filler and having excellent mechanical properties. <P>SOLUTION: In the insulation heat radiation film 1 including organic particles 2, an inorganic filler 3 having insulation and thermal conductivity, and a cross-linked rubber 4, the ratio of the average particle diameter of the organic particles to that of the inorganic filler (the organic particle/the inorganic filler) is adjusted to 1/1 or more. The average particle diameter of the organic particle is around 5-50 &mu;m. The ratio of the average particle diameter of the organic particle to that of the inorganic filler (the organic particle/the inorganic filler) may be 1.5/1 or more. The ratio (weight ratio) of the organic particle to the inorganic filler (the organic particle/the inorganic filler) may be around 1/1-1/5. The ratio of the inorganic filler is around 40-60 wt.% relative to the entire film, and the thermal conductivity may be 2 W/(m K) or more. The shape of the inorganic filler may be a plate shape, and especially the filler may comprise boron nitride. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP2012224711(A) 申请公布日期 2012.11.15
申请号 JP20110092234 申请日期 2011.04.18
申请人 DAICEL CORP 发明人 ONOMICHI HIROSHI
分类号 C08L15/00;C08C19/34;C08J5/18;C08K3/00 主分类号 C08L15/00
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