| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a thermosetting resin composition, the deterioration of which cured material under the atmosphere at ≥200°C is almost not observed, and also having a low viscosity. <P>SOLUTION: The thermosetting resin composition is characterized by including (A) 100 pts.wt. of cyanate ester compound having on average ≥2 cyanato groups in one molecule, (B) 1 to 500 pts.wt. of phenol compound, (C) 1 to 500 pts.wt. of a triallyl isocyanurate and (D) 1 to 800 pts.wt. of an inorganic filler and further (E) 0 to 20 pts.wt. of an epoxy resin based on 100 pts.wt. of the total of the components (A), (B) and (C), and having ≤5 Pa s minimum viscosity at 20 to 80°C. <P>COPYRIGHT: (C)2013,JPO&INPIT |
