发明名称 THROUGH WIRING BOARD, ELECTRONIC DEVICE PACKAGE, AND ELECTRONIC COMPONENT
摘要 <p>This through wiring board is provided with a single substrate which has a first main surface and a second main surface, and with multiple feed-through wires which, provided inside of the substrate so as to connect the first main surface and the second main surface, have at least first portions extending in a direction other than the thickness direction of the substrate, second portions constituting one end of the feed-through wires, and third portions constituting the other end of the feed-through wires. The second portions are approximately perpendicular to the first main surface and are exposed at the first main surface, the third portions are approximately perpendicular to the second main surface and are exposed at the second main surface. The multiple feed-through wires have approximately the same length.</p>
申请公布号 WO2012153839(A1) 申请公布日期 2012.11.15
申请号 WO2012JP62139 申请日期 2012.05.11
申请人 FUJIKURA LTD.;YAMAMOTO SATOSHI 发明人 YAMAMOTO SATOSHI
分类号 H05K1/11;H01L23/12 主分类号 H05K1/11
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