| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor module which eases stress applied to an area between members, located in a heat transmission path of heat generated in a semiconductor element, when the members are exposed to heat change. <P>SOLUTION: A semiconductor module 1 includes: an insulation substrate 20; a cooler 10; and a contact member 34. The contact member 34 is provided between the insulation substrate 20 and the cooler 10 so as to make a point contact or a line contact with at least one of the insulation substrate 20 and the cooler 10. <P>COPYRIGHT: (C)2013,JPO&INPIT |
