| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide amorphous silica particle capable of forming highly durable solidified articles when making a sealing material for a semiconductor by adding the same into curable resin, having excellent dispersibility to the curable resin, and capable of being properly used for in under filling mounting such as high density mounting while securing good flowability. <P>SOLUTION: The amorphous silica particle being used to the sealing material for a semiconductor is characterized in that the ratio (I(adOH)/I(SiO)) of the maximum light absorbency (I(adOH)) of the peak of an OH bond of silanol having a peak top in 3,400 to 3,500 cm<SP POS="POST">-1</SP>and the maximum light absorbency (I(SiO)) of the peak of a siloxane bond in Fourier transform infrared absorbing spectrum (FT-IR) is 0.0010 or more and less than 0.0025. <P>COPYRIGHT: (C)2013,JPO&INPIT |
