| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a tacky adhesive tape for a flexible printed circuit, from which a release liner can be released without being torn off even after being subjected to a high temperature process such as a solder reflow process. <P>SOLUTION: The tacky adhesive tape includes a release liner on at least one surface of a tacky adhesive layer, wherein a tensile strength of the release liner in a length direction is 50 to 150 MPa, and a tensile strength of the release liner in a length direction after heating at 280°C for 5 minutes is 20 to 120 MPa. <P>COPYRIGHT: (C)2013,JPO&INPIT |
