| 摘要 |
A technique is described for increasing the capacitance of a metallized polymer film capacitor where the capacitor electrodes have been fabricated with so-called patterned film. The pattern as typically embodied by prior art allows the capacitor to better survive dielectric failures, or exhibit improved tolerance to extreme pulse current. The pattern is created by areas on the capacitor electrodes which have no metal, so there will be a capacitance reduction penalty for using said patterned electrodes. Each section of the pattern is connected by a local fuse, which is disconnected from the rest of the capacitor when the current flowing through a defect vaporizes the surrounding metal. An extremely light metallization underlayer is described which allows the better survival characteristic provided by pattern film should a dielectric failure occur, yet mitigates the capacitance loss previously seen for capacitors made with conventional patterned metallized electrodes on the capacitor film.
|
