| 摘要 |
An electronics enclosure system includes a conductive polymer which includes electromagnetic interference shielding properties and produced to enhancing SE, reducing material costs, and improving thermal flow. Parallel hex shaped EMI waveguides placed in a honeycomb pattern are stacked in a staggered fashion with similar hex shaped EMI waveguides placed in a honeycomb pattern. The parallel hex shaped EMI waveguides extend into the interior and/or cuts into one or more sides of a an electronics enclosure. An EMI shielding polymer material, such as a coated polymer, or a nickel-fiber carbon polymer such as Primere® providing sufficient EMI shielding (or alternately a material that can be formed such as Superplastic Zinc) is used, having the result that the need for shielding gaskets are reduced, material usage is decreased, and thermal flow is greatly improved. |
