| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a power amplifier which is space-saving and reduces the effect of a bonding wire connecting an MMIC and an external circuit of the MMIC in a relatively simple configuration. <P>SOLUTION: There is provided a power amplifier comprising: an MMIC substrate; a high-frequency probe pad arranged on the MMIC substrate; and a metal plate arranged adjacent to the high-frequency probe pad on the MMIC substrate and used for connecting the MMIC to an external circuit of the MMIC with a bonding wire. <P>COPYRIGHT: (C)2013,JPO&INPIT |
