| 摘要 |
<P>PROBLEM TO BE SOLVED: To suppress occurrence of voids between wires, disconnection of the wires, or the like in a method of manufacturing an electronic device, in which a structure made by forming a plurality of wires arranged on one surface of a circuit board by wire bonding is sealed with a rectangular plate-shaped mold resin by transfer mold method using a mold having two gates. <P>SOLUTION: In a mold 100, a first gate 110 is disposed at one corner part located close to one side of a cavity 101 that forms a rectangular plate-shaped space, and a second gate 120 is disposed at the other corner part. A position of a confluence part of a mold resin 80 from both gates is made closer to the second gate 120 by making the flow of loading for the first gate 110 larger than the flow of loading for the second gate 120. As a structure 1, one provided with a plurality of wires 20 is prepared at a position in one surface 11 of a circuit board 10 which is located on the downstream side of the first gate 110. <P>COPYRIGHT: (C)2013,JPO&INPIT |
