| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a technology which can form an application film by applying an application solution to a substrate, and can reduce time required for heat treatment of the application film. <P>SOLUTION: An application apparatus includes: a holding part for holding a substrate; a nozzle to supply an application solution to the substrate; a movement mechanism that moves the holding part relative to the nozzle in order to form an application film over the entire substrate; and an electromagnetic wave irradiation section which irradiates an electromagnetic wave toward the substrate held by the holding part, and heats the entire application film to a temperature at which molecules contained in the application film are bonded to each other. After forming the application film, there is no need to move the substrate in order to perform heat treatment. This reduces the time required for the treatment, thereby improving throughput. <P>COPYRIGHT: (C)2013,JPO&INPIT |
