发明名称 SOLID STATE IMAGE PICKUP DEVICE AND MANUFACTURING METHOD OF THE SAME
摘要 <P>PROBLEM TO BE SOLVED: To easily achieve a solid state image pickup device equipped with an optical waveguide having high light-harvesting capability in which a material having a high refraction factor is filled. <P>SOLUTION: A solid state image pickup device comprises a light receiving part 111 formed on a semiconductor substrate 101, an insulation film laminate 102 formed on the semiconductor substrate and including interlayer insulation films and having a first recess at a location corresponding to the light receiving part, and an optical waveguide 103 formed in the first recess for introducing light to the light receiving part. The optical waveguide has a first film 131 and a second film 132 sequentially formed from the insulation film laminate side. Each of refraction factors of the first film and the second film is higher than a refraction factor of the interlayer insulation film. The first film covers a lateral face and a bottom face of the first recess and has a second recess at a location corresponding to the first recess. The second film is formed in such a way as to fill the second recess and a film thickness of a portion formed on the lateral face of the first recess in the first film is thinner at an upper part than at a lower part of the first recess. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP2012227510(A) 申请公布日期 2012.11.15
申请号 JP20120005233 申请日期 2012.01.13
申请人 PANASONIC CORP 发明人 SUZUKI SHIGERU;ONAKA KEIJI;YAMAMOTO KOICHI
分类号 H01L27/14;H04N5/369 主分类号 H01L27/14
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