发明名称 |
SEMICONDUCTOR PACKAGE, SEMICONDUCTOR DEVICE MANUFACTURING METHOD, AND SOLID-STATE IMAGING DEVICE |
摘要 |
A semiconductor package includes: a sheet-like thin plate on which a semiconductor chip is secured; and a substrate including a wiring layer, disposed on the thin plate to extend over a part of a region surrounding the region where the semiconductor chip is secured or over the entire surrounding region, wherein the semiconductor chip and the substrate are electrically connected. |
申请公布号 |
US2012286384(A1) |
申请公布日期 |
2012.11.15 |
申请号 |
US201213461910 |
申请日期 |
2012.05.02 |
申请人 |
ISHIKIDA MASAYUKI;SONY CORPORATION |
发明人 |
ISHIKIDA MASAYUKI |
分类号 |
H01L31/0232;H01L21/50;H01L23/52 |
主分类号 |
H01L31/0232 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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