| 摘要 |
Thermal insulation materials which have no binders in the form of liquids, which adhesively bond particles, and which are treated with low-volatility organosilanes or organosiloxanes whose boiling points are greater than 130° C. under atmospheric pressure, the k thermal conductivity being between 0.014 and 0.040 W/mK and the density being in the range from 50 to 300 kg/m3. |
