| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a light emitting element package having a new structure. <P>SOLUTION: The present invention relates to a light emitting element package. The package includes: a ceramic body including a cavity formed therein; an ultraviolet light emitting diode formed in the cavity; a support member formed on the ceramic body and surrounding the cavity; and a glass film coupled to the support member and covering the cavity. Accordingly, heat dissipation is improved by applying the ceramic body in the ultraviolet light emitting element package, and the manufacturing process is simplified without other components by directly attaching the glass film to the ceramic body, thereby reducing the manufacturing cost. <P>COPYRIGHT: (C)2013,JPO&INPIT |
