发明名称 METHOD FOR BONDING WORKPIECE, AND APPARATUS FOR BONDING WORKPIECE
摘要 <P>PROBLEM TO BE SOLVED: To bond two workpieces consisting of a resin workpiece and a resin workpiece or a resin workpiece and a glass substrate while ensuring bonding uniformity and preventing troubles such as an alignment shift and breakage. <P>SOLUTION: A first workpiece W1 is placed on an inverting stage 31 of an inverting stage unit 30, a second workpiece W2 is placed on the work stage 21 of a pressurizing stage unit 20, and is irradiated with UV light from a light irradiation unit 10. Then, the inverting stage 31 is inverted 180&deg;, the workpieces W1, W2 are overlapped each other on the work stage 21, and the workpieces W1, W2 are pressurized and pre-bonded to each other. Then, the workpieces in the pre-bonded state are transferred to a heating stage by transfer means, the temperature of the workpieces is increased to a prescribed temperature by heating the workpieces by a heating mechanism, and the temperature is maintained until bonding is completed. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP2012223858(A) 申请公布日期 2012.11.15
申请号 JP20110094070 申请日期 2011.04.20
申请人 USHIO INC 发明人 YOSHIHARA KEITA;SUZUKI SHINJI;MORITA KINICHI;FUSHITSUGU HIDEKI
分类号 B81C3/00 主分类号 B81C3/00
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