SEMICONDUCTOR CHIP PACKAGE ASSEMBLY AND METHOD FOR MAKING SAME

摘要

A microelectronic assembly may include a microelectronic element having a plurality of element contacts at a face thereof, and a compliant dielectric element having a Young's modulus of less than about two gigapascal (GPa) and substrate contacts at a first surface joined to the element contacts. The substrate contacts may be electrically connected with terminals at a second surface of the compliant dielectric element that opposes the first surface, through conductive vias in the compliant dielectric element. A rigid underfill may be between the face of the microelectronic element and the first surface of the compliant dielectric element. The terminals may be usable for bonding the microelectronic assembly to corresponding contacts of a component external to the microelectronic assembly.