发明名称 Micro-scale System to Provide Thermal Isolation and Electrical Communication Between Substrates
摘要 A microscale apparatus includes a microscale rigidized Parylene strap having a reinforcement structure extending from a first side of the strap, a first silicon substrate suspended by the microscale rigidized Parylene strap, the microscale rigidized Parylene strap conformally coupled to the first substrate, and a second substrate conformally coupled to the microscale rigidized Parylene strap to suspend the first silicon substrate through the microscale rigidized Parylene strap.
申请公布号 US2012286884(A1) 申请公布日期 2012.11.15
申请号 US201113105735 申请日期 2011.05.11
申请人 DENATALE JEFFREY F.;STUPAR PHILIP A.;LIN YU-HUA;BORWICK ROBERT L.;PAPAVASILIOU ALEXANDROS P.;TELEDYNE SCIENTIFIC & IMAGING, LLC 发明人 DENATALE JEFFREY F.;STUPAR PHILIP A.;LIN YU-HUA;BORWICK ROBERT L.;PAPAVASILIOU ALEXANDROS P.
分类号 H01S1/02;B05D3/10;B05D5/00;B32B3/10;B32B3/12;B32B3/30;B32B15/08;C23F1/00;H05K1/14 主分类号 H01S1/02
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