发明名称 |
Micro-scale System to Provide Thermal Isolation and Electrical Communication Between Substrates |
摘要 |
A microscale apparatus includes a microscale rigidized Parylene strap having a reinforcement structure extending from a first side of the strap, a first silicon substrate suspended by the microscale rigidized Parylene strap, the microscale rigidized Parylene strap conformally coupled to the first substrate, and a second substrate conformally coupled to the microscale rigidized Parylene strap to suspend the first silicon substrate through the microscale rigidized Parylene strap.
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申请公布号 |
US2012286884(A1) |
申请公布日期 |
2012.11.15 |
申请号 |
US201113105735 |
申请日期 |
2011.05.11 |
申请人 |
DENATALE JEFFREY F.;STUPAR PHILIP A.;LIN YU-HUA;BORWICK ROBERT L.;PAPAVASILIOU ALEXANDROS P.;TELEDYNE SCIENTIFIC & IMAGING, LLC |
发明人 |
DENATALE JEFFREY F.;STUPAR PHILIP A.;LIN YU-HUA;BORWICK ROBERT L.;PAPAVASILIOU ALEXANDROS P. |
分类号 |
H01S1/02;B05D3/10;B05D5/00;B32B3/10;B32B3/12;B32B3/30;B32B15/08;C23F1/00;H05K1/14 |
主分类号 |
H01S1/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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