| 摘要 |
A foaming process for preparing wafer-level glass micro-cavities that include, etching silicon trenches on a Si wafer through Si micro-machining process; placing high-temperature outgassing agent in the silicon trenches; bonding the Si wafer with a piece of glass wafer by anodic bonding to form sealing cavities; heating up the bonded wafer, and holding the temperature the high-temperature outgassing agent such that the molten glass corresponding to the sealing cavities deforms and structures corresponding to the silicon trenches are formed in the glass; cooling down to obtain wafer-level glass micro-flow channels. |
