| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a wiring board which is capable of improving insulation reliability in a through-hole, a semiconductor device, and a method for manufacturing a wiring board. <P>SOLUTION: A wiring board 1 comprises: a board body 10 having a through-hole 10X penetrating between a first main surface R1 and a second main surface R2; a through-electrode 12 formed in the through-hole 10X; and a capacitor 20 having a capacitor part 21 formed by sequentially laminating a first electrode 22, a dielectric layer 23, and a second electrode 24 on an insulating film 11 covering the first main surface R1. An inner wall surface of the through-hole 10X is sequentially covered with at least the insulating film 11 covering the inner wall surface of the through-hole 10X, a first metal layer 32 made of the same material as the first electrode 22, a dielectric layer 33 made of the same material as the dielectric layer 23, and a second metal layer 34 made of the same material as the second electrode 24. <P>COPYRIGHT: (C)2013,JPO&INPIT |
