| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method and an apparatus for laser beam machining that can machine a portion adjacent to a thin film without damaging the thin film, and can form a straight through-groove. <P>SOLUTION: The method for laser beam machining comprises irradiating a substrate 1 made of a laser-transmissible material and having surfaces 11, 12 on which thin films 31, 32 are formed, respectively, with a laser beam 9, wherein the laser beam 9 is applied to a portion near the thin films 31, 32 on the substrate to form through-grooves thereon, by applying the laser beam 9 at a tilted angle relative to the substrate 1 so that the transmitted light 92 of the laser beam 9 is at an angle that prevents the thin film 32 from being irradiated with. <P>COPYRIGHT: (C)2013,JPO&INPIT |
