发明名称 ADJUSTABLE THERMAL FORMING DIE ASSEMBLY
摘要 An adjustable thermal die assembly is provided. The thermal die assembly includes a thermal forming die and at least one insert. The thermal forming die has at least one die cavity of a select shape. The die further has at least one opening to the at least one die cavity. The at least one insert has at least one internal passage that is conformed to have a shape of the at least one opening to the at least one die cavity of the die. Moreover, the at least one insert is configured and arranged to be selectively coupled to the die with the at least one internal passage of the at least one insert aligning with the at least one opening of the at least one die cavity to selectively increase a depth of a forming cavity of the thermal forming assembly.
申请公布号 US2012286446(A1) 申请公布日期 2012.11.15
申请号 US201113106513 申请日期 2011.05.12
申请人 MILLER DANIEL S.;SAMPSON STEVEN E.;REID LOUJEAN;FRYER FRANK D.;PETERSEN DANNY K.;LINDSEY KURT A.;HORMEL FOODS CORPORATION 发明人 MILLER DANIEL S.;SAMPSON STEVEN E.;REID LOUJEAN;FRYER FRANK D.;PETERSEN DANNY K.;LINDSEY KURT A.
分类号 B29C51/10;B29C51/26 主分类号 B29C51/10
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