发明名称 |
Pressure measuring sensor arrangement has partial connectors which are arranged at cavity and are provided with bonding surfaces for connector and substrate |
摘要 |
<p>The sensor arrangement has partial connectors (B1,B2) which are arranged at cavity (HR) and are provided with bonding surfaces for connector (AD) and substrate (SU). The partial connector (B1) is arranged near the cavity rather than the partial connector (B2). A closed fluid-tight annular portion is formed around the cavity. The bonding surface of partial connector (B2) is wider than the bonding surface of partial connector (B1). An independent claim is included for manufacturing method of pressure measuring sensor arrangement.</p> |
申请公布号 |
DE102012103283(A1) |
申请公布日期 |
2012.11.15 |
申请号 |
DE201210103283 |
申请日期 |
2012.04.16 |
申请人 |
LEWICKI MICROELECTRONIC GMBH |
发明人 |
SAILER, MAXIMILIAN;NEUBERT, JENS |
分类号 |
G01L19/00;G01L9/00;G01L19/06 |
主分类号 |
G01L19/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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