发明名称 Pressure measuring sensor arrangement has partial connectors which are arranged at cavity and are provided with bonding surfaces for connector and substrate
摘要 <p>The sensor arrangement has partial connectors (B1,B2) which are arranged at cavity (HR) and are provided with bonding surfaces for connector (AD) and substrate (SU). The partial connector (B1) is arranged near the cavity rather than the partial connector (B2). A closed fluid-tight annular portion is formed around the cavity. The bonding surface of partial connector (B2) is wider than the bonding surface of partial connector (B1). An independent claim is included for manufacturing method of pressure measuring sensor arrangement.</p>
申请公布号 DE102012103283(A1) 申请公布日期 2012.11.15
申请号 DE201210103283 申请日期 2012.04.16
申请人 LEWICKI MICROELECTRONIC GMBH 发明人 SAILER, MAXIMILIAN;NEUBERT, JENS
分类号 G01L19/00;G01L9/00;G01L19/06 主分类号 G01L19/00
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