| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an inexpensive resin composition low in dielectric constant and excellent in molding processability, heat resistance, impact resistance, and ductility. <P>SOLUTION: The resin composition comprises (A) the polyphenylene ether, (B) polyphenylene sulfide, and (C) an epoxy group-containing ethylene copolymer or epoxy group-containing styrene block copolymer, in which polystyrene is grafted, wherein the component (A) is a sequential phase, and the components (B) and (C) are each a disperse phase. <P>COPYRIGHT: (C)2013,JPO&INPIT |
