| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a processing method of a package substrate which allows for division of the package substrate along the dividing line without using a jig for supporting the package substrate or a dicing tape. <P>SOLUTION: The processing method of a package substrate comprises: a step of holding the surface of the synthetic resin 22 of a package substrate or the surface of a metal plate 21 on the chuck table 31 of a cutting device, positioning a cutting blade 323 on the dividing line in a device region 23 while avoiding the circumferential excess region, and forming first cut grooves 251 and 252 having a depth not reaching the surface of the synthetic resin or the surface of the metal plate; and a step of positioning the cutting blade on the dividing line from the surface of the synthetic resin or the surface of the metal plate, and forming a plurality of second cut grooves 261 having a depth not reaching the first cut groove along the plurality of dividing lines. The package substrate is divided into individual package devices by interconnecting the first and second cut grooves formed along the plurality of dividing lines. <P>COPYRIGHT: (C)2013,JPO&INPIT |
