| 摘要 |
<P>PROBLEM TO BE SOLVED: To enhance throughput of substrate processing while depositing an adhesion agent appropriately on the surface of a substrate. <P>SOLUTION: In the wafer processing for depositing a mold release agent on the surface of a wafer, the surface of the wafer is cleaned, at first, by subjecting the surface of the wafer to UV irradiation in a coating unit (step A2). Subsequently, an adhesion agent is applied to the surface of the wafer while subjecting the surface of the wafer to UV irradiation in the coating unit (step A3). Thereafter, the adhesion agent on the wafer is rinsed in a rinse unit, and an unreacted part of the adhesion agent is removed (step A4). Consequently, an adhesion film of a predetermined thickness is deposited on the surface of the wafer. <P>COPYRIGHT: (C)2013,JPO&INPIT |
