| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device manufacturing method and a semiconductor device in which a semiconductor component and a substrate are bonded by an ultraviolet-curable adhesive, which increase an adhesive strength by the ultraviolet-curable adhesive. <P>SOLUTION: A semiconductor manufacturing method comprises: coating an ultraviolet-curable adhesive 10 preliminarily containing a reflected particle 11 subjected to ultraviolet reflection on a surface on an island part 3 of a substrate 2; arranging a semiconductor component 4 on the island part 3 of the substrate 2 with intervening the ultraviolet-curable adhesive 10; and irradiating ultraviolet light from the side of a lateral face of the substrate 2 on the ultraviolet-curable adhesive 10 to cure the ultraviolet-curable adhesive 10 and the semiconductor component 4 is bonded and fixed to the substrate 2. <P>COPYRIGHT: (C)2013,JPO&INPIT |
