FLUX APPLICATION METHOD, MANUFACTURING METHOD OF MOUNTING SUBSTRATE, AND FLUX APPLICATION DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a flux application method which sufficiently supplies flux to a region of a printed wiring board where an electronic component having high height is mounted.

SOLUTION: A flux application method includes: a process where a first flux application region is formed; and a process where a second flux application region is formed. In the process where the second flux application region is formed, the second flux application region is formed so as to cover the first flux application region. In the process where the second flux application region is formed, a second spray nozzle 70 moves in a direction different from a direction that a first spray nozzle 60 moves in the process where the first flux application region is formed.

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