发明名称 |
SENSOR DEVICE WITH SEALING STRUCTURE |
摘要 |
<P>PROBLEM TO BE SOLVED: To provide an apparatus and related fabrication methods for a sensor device. <P>SOLUTION: The sensor device includes a sensor structure including a first portion having a sensing arrangement formed thereon and a second structure. A sealing structure is interposed between the sensor structure and the second structure, where the sealing structure surrounds the first portion of the sensor structure. The sealing structure establishes a fixed reference pressure on a first side of the first portion, and an opposing side of the first portion is exposed to an ambient pressure. <P>COPYRIGHT: (C)2013,JPO&INPIT |
申请公布号 |
JP2012225925(A) |
申请公布日期 |
2012.11.15 |
申请号 |
JP20120096894 |
申请日期 |
2012.04.20 |
申请人 |
FREESCALE SEMICONDUCTOR INC |
发明人 |
STEPHEN R HOOPER;DWIGHT L DANIELS;JAMES D MACDONALD;WILLIAM G MCDONALD;CHUNLIN C XIA |
分类号 |
G01L9/00;B81B3/00;H01L29/84 |
主分类号 |
G01L9/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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