发明名称 SENSOR DEVICE WITH SEALING STRUCTURE
摘要 <P>PROBLEM TO BE SOLVED: To provide an apparatus and related fabrication methods for a sensor device. <P>SOLUTION: The sensor device includes a sensor structure including a first portion having a sensing arrangement formed thereon and a second structure. A sealing structure is interposed between the sensor structure and the second structure, where the sealing structure surrounds the first portion of the sensor structure. The sealing structure establishes a fixed reference pressure on a first side of the first portion, and an opposing side of the first portion is exposed to an ambient pressure. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP2012225925(A) 申请公布日期 2012.11.15
申请号 JP20120096894 申请日期 2012.04.20
申请人 FREESCALE SEMICONDUCTOR INC 发明人 STEPHEN R HOOPER;DWIGHT L DANIELS;JAMES D MACDONALD;WILLIAM G MCDONALD;CHUNLIN C XIA
分类号 G01L9/00;B81B3/00;H01L29/84 主分类号 G01L9/00
代理机构 代理人
主权项
地址