| 摘要 |
<P>PROBLEM TO BE SOLVED: To divide a wafer, in which a ring-like reinforcing part is formed by grinding the rear side of a device region on a rear surface, with a metal film coated on the rear surface, into devices from the rear surface side. <P>SOLUTION: A device region in which a plurality of devices are partitioned and formed by a division schedule line is surrounded with an outer peripheral marginal region, to constitute the surface of a wafer 1. A rear surface 1b of the wafer is ground to form a metal film 14 on the rear surface 1b, and then it is cut along the division schedule line, into individual devices. In this method, the rear side of a device region in the rear surface 1b of the wafer 1 is ground to form a recess 12. A ring-like reinforcing part 13 is formed around it, and the metal film 14 is formed on the rear surface 1b, and then the ring reinforcing part 13 is cut to remove the metal film 14. The division schedule line is detected in the removed portion by means of infrared imaging, for cutting into devices. <P>COPYRIGHT: (C)2013,JPO&INPIT |
