| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a laminated material used for an insulating substrate, which has a good property of solder joint and can prevent cracking and peeling at a joint interface surface. <P>SOLUTION: A laminated material 1A comprises: a Ni layer 2 formed of Ni or Ni alloy, on whose surface 2a a semiconductor element 21 is jointed; a Ti layer 4 formed of Ti or Ti alloy, which is arranged on one side of the Ni layer 2; and an Al layer 6 formed of Al or Al alloy, which is arranged in a laminated form at a side of the Ti layer 4 that is opposite to another side where the Ni layer 2 is arranged. The Ni layer 2 and the Ti layer 4 are joined together by using a discharge plasma sintering method. The Ti layer 4 and the Al layer 6 are joined together by using a discharge plasma sintering method. <P>COPYRIGHT: (C)2013,JPO&INPIT |
