| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a substrate to which a voltage for detecting a conduction state of a wiring for chipping detection can be applied after forming electronic components by dicing even in a state where the wiring for chipping detection is covered by another component. <P>SOLUTION: An electronic component 40 includes a substrate 41 having one rectangular principal surface 41a and another rectangular principal surface 41b lying in parallel with each other. On the one principal surface 41a of the substrate 41, a first wiring 42 for chipping detection is arranged. Further, on the other principal surface 41b of the substrate 41, a second wiring 44 for chipping detection is arranged. The first wiring 42 for chipping detection is electrically connected with the second wiring 44 for chipping detection through a through wiring 43a. <P>COPYRIGHT: (C)2013,JPO&INPIT |
