THROUGH WIRING SUBSTRATE, ELECTRONIC DEVICE PACKAGE, AND ELECTRONIC COMPONENT

摘要

This through wiring substrate is provided with a single substrate which has a first main surface and a second main surface, and with multiple feed-through wires which connect the first main surface and the second main surface and have first portions extending in parallel to one another. Neighboring feed-through wires are arranged such that imaginary axes which extend perpendicularly to at least the first main surface or the second main surface and which pass through the center of said first portions are spaced apart and parallel to one another.