| 摘要 |
<P>PROBLEM TO BE SOLVED: To solve the problem of a QFN type package which is required of high reliability for automotive applications that, since most of lead side faces are covered with lead-to-lead resin protrusions, solder fillets are not formed satisfactorily during reflow mounting, so that, if an attempt is made to remove the lead-to-lead resin protrusions by mechanical means using a punching die, cracks in the package body or terminal deformation may result, or if plenty of space is left between the punching die and the package body to avoid it, a resin residue may occur, making it difficult to remove the lead-to-lead resin protrusions completely. <P>SOLUTION: The invention applied herein relates to a manufacturing method of a QFN type packaged semiconductor integrated circuit device using a multi-ganged lead frame having a tie bar for bundling outer ends of plural leads, in which it involves removing the sealing resin filled in between a mold cavity outer peripheral and the tie bar by a laser before executing a surface treatment such as solder plating. <P>COPYRIGHT: (C)2013,JPO&INPIT |
