发明名称 NANOIMPRINT DEVICE AND MOLD RELEASE METHOD
摘要 <P>PROBLEM TO BE SOLVED: To release a mold easily from an object to be molded by reducing the release force significantly without using a mold release agent. <P>SOLUTION: In a nanoimprint device 1 for molding a material to be molded by transferring a desired pattern of nanometer order formed in a mold 30 to the material to be molded, gas is blown between the mold 30 and the material to be molded, and the pressure between the mold 30 and the material to be molded is increased by the gas entering therebetween. More specifically, the gas is blown so that the pressure rise between the mold 30 and the material to be molded approaches at least the pressure in a space including the mold 30 and the material to be molded, and the volume of gas entering between the mold and the material to be molded is controlled. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP2012227430(A) 申请公布日期 2012.11.15
申请号 JP20110095229 申请日期 2011.04.21
申请人 HOYA CORP 发明人 WATANABE YUSUKE;SUZUKI KOTA
分类号 H01L21/027;B29C33/46;B29C59/02;G11B5/84 主分类号 H01L21/027
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