发明名称 |
LIQUID HIGH SOLIDS BINDER COMPOSITION |
摘要 |
The invention described herein pertains to formaldehyde free, thermosetting liquid high solids binder compositions having rapid cure times on thermal curing and slow cure times at ambient temperatures so that the uncured binder compositions and products which comprise the uncured binder compositions have improved shelf lives. |
申请公布号 |
WO2012152731(A1) |
申请公布日期 |
2012.11.15 |
申请号 |
WO2012EP58322 |
申请日期 |
2012.05.06 |
申请人 |
KNAUF INSULATION;MUELLER, GERT |
发明人 |
MUELLER, GERT |
分类号 |
C08G12/00;C08G14/00;C08G16/00;C08L61/00 |
主分类号 |
C08G12/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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