| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an amorphous silica particle capable of surely suppressing the deterioration in flowability and the generation of voids, and being used for a sealant for a semiconductor regardless of manufacturing lots, when the amorphous silica particle is added to a hardening resin and is used as the sealant for the semiconductor. <P>SOLUTION: The amorphous silica particle is an amorphous silica particle used for a sealant for a semiconductor, and is characterized that an amount of silanol group per unit surface area obtained by dividing a concentration (mmol/g) of silanol group on a surface of the particle by a specific surface area (m<SP POS="POST">2</SP>/g) of the particle determined by BET method, is more than 0.010 mmol/m<SP POS="POST">2</SP>and less than 0.065 mmol/m<SP POS="POST">2</SP>. <P>COPYRIGHT: (C)2013,JPO&INPIT |
