发明名称 |
METHODS OF REMOVING A MATERIAL LAYER FROM A SUBSTRATE USING WATER VAPOR TREATMENT |
摘要 |
Embodiments of the invention generally relate to methods of removing and/or cleaning a substrate surface having different material layers disposed thereon using water vapor plasma treatment. In one embodiment, a method for cleaning a surface of a substrate includes positioning a substrate into a processing chamber, the substrate having a dielectric layer disposed thereon forming openings on the substrate, exposing the dielectric layer disposed on the substrate to water vapor supplied into the chamber to form a plasma in the water vapor, maintaining a process pressure in the chamber at between about 1 Torr and about 120 Torr, and cleaning the contact structure formed on the substrate.
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申请公布号 |
US2012285481(A1) |
申请公布日期 |
2012.11.15 |
申请号 |
US201113291286 |
申请日期 |
2011.11.08 |
申请人 |
LEE KWANGDUK DOUGLAS;RATHI SUDHA;CHAN CHIU;SEAMONS MARTIN J.;KIM BOK HEON;APPLIED MATERIALS, INC. |
发明人 |
LEE KWANGDUK DOUGLAS;RATHI SUDHA;CHAN CHIU;SEAMONS MARTIN J.;KIM BOK HEON |
分类号 |
B08B6/00;B08B5/00;B08B7/04 |
主分类号 |
B08B6/00 |
代理机构 |
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