发明名称 |
Leadframe and method for packaging semiconductor die |
摘要 |
<p>In one embodiment, a method is provided for packaging a semiconductor die. A leadframe having a die-pad and one or more lead-pads is placed (502) on an assembly surface. The die-pad has a base portion (202) resting on the assembly surface, an upper portion (204) on the base portion extending laterally from the base portion, and a support arm (208) extending from and supporting the upper portion of die-pad. A semiconductor die (206) is wirebonded (504) to a top surface of the upper portion of the die-pad. The semiconductor die is wirebonded (506) to the one or more lead-pads (210). The semiconductor die and leadframe are encased (508) in a package material (802). The package material fills a space between the upper portion of the die-pad and the assembly surface. A portion of the support arm located in a cutting lane is removed (512).</p> |
申请公布号 |
EP2523211(A1) |
申请公布日期 |
2012.11.14 |
申请号 |
EP20110165403 |
申请日期 |
2011.05.10 |
申请人 |
NXP B.V. |
发明人 |
BOETTCHER, TIM;WALCZYK, SVEN;WONG, FEI-YING;UMALI, POMPEO;GROENHUIS, ROELF ANCO JACOB;ROHRMOSER, BERND;LEE, STEVECHIFAI;NOREN, MARKUS BJOERN ERIK;TSANG, PAUL PANG HING |
分类号 |
H01L21/56;H01L23/31;H01L23/495 |
主分类号 |
H01L21/56 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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