| 摘要 |
PURPOSE: A method for a wire bonding is provided to improve the reliability of a wiring boding process and a semiconductor package by preventing the filling of a bonding pad without using the weight of a capillary. CONSTITUTION: A wire ball(102) is formed in the end part of a wire(100). The metal layer(104) is formed in the bottom of the wire ball. The wire ball having the metal layer is bonded to the bonding pad of the semiconductor chip. The metal layer includes a metallic compound between the wire ball and a catalyst catalyzing a metallic compound between bonding pads or metallic compound. The metallic layer includes a material for the wire ball and a material for the bonding pad. |
