| 摘要 |
PURPOSE: A package stack type assembly is provided to perform operation of assembly at high speed and to limit signaling time between devices. CONSTITUTION: A substrate(12) has a first side(14) and a second side(16) which is separate from the first side. A microelectronic element(22) is located on the first side of the substrate within a first area. A conductive element(28) is electrically connected to the microelectronic element. The conductive element is arranged as a first array of a first configuration. The conductive element is exposed to one or more sides of the first side and the second side within a second area. A wire bond comprises an end side which is separated from a base. |
