| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide: a positive photosensitive resin composition having high sensitivity; a method for producing a cured relief pattern using the composition; and a semiconductor device having the cured relief pattern. <P>SOLUTION: The positive photosensitive resin composition comprises (A) 100 parts by mass of a polymer soluble in an aqueous alkali solution, (B) 1-50 parts by mass of a photoacid generator, (C) 0.01-30 parts by mass of a sulfonic acid anhydride, and (D) 0.1-70 parts by mass of a crosslinking agent. <P>COPYRIGHT: (C)2009,JPO&INPIT |
