发明名称 |
Wafer stacked package waving bertical heat emission path and method of fabricating the same |
摘要 |
A wafer stacked semiconductor package (WSP) having a vertical heat emission path and a method of fabricating the same are provided. The WSP comprises a substrate on which semiconductor chips are mounted; a plurality of semiconductor chips stacked vertically on the substrate; a cooling through-hole formed vertically in the plurality of semiconductor chips, and sealed; micro holes formed on the circumference of the cooling through-hole; and coolant filling the inside of the cooling through-hole. Accordingly, the WSP reduces a temperature difference between the semiconductor chips and quickly dissipates the heat generated by the stacked semiconductor chips.
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申请公布号 |
US8310046(B2) |
申请公布日期 |
2012.11.13 |
申请号 |
US201113235850 |
申请日期 |
2011.09.19 |
申请人 |
BAEK JOONG-HYUN;LEE HEE-JIN;SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
BAEK JOONG-HYUN;LEE HEE-JIN |
分类号 |
H01L23/34 |
主分类号 |
H01L23/34 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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