发明名称 |
Shape measurement apparatus and shape measurement method |
摘要 |
An apparatus and method are provided for measuring the end surface of a disk-shaped semiconductor wafer based on its projection image, without the influence of contaminants on the end surface. A rotation supporting mechanism supports a wafer between a first supporting position rotated by +δrelative to a predetermined reference position and a second supporting position rotated by −δdegrees at two or more supporting positions. An image sensor picks up a projection image of the wafer's end surface. An index value for the end surface is calculated for each of a plurality of obtained projection images. One representative value of the calculated index values or an aggregate value is obtained, and a shape measurement of the wafer's end surface corresponding to the reference supporting position is derived. When the wafer's radius and a chamfer width are set as r and k, δ≧cos−1 ((r-k)/r) is satisfied. |
申请公布号 |
US8310536(B2) |
申请公布日期 |
2012.11.13 |
申请号 |
US20080452230 |
申请日期 |
2008.07.18 |
申请人 |
AKAMATSU MASARU;HASHIZUME HIDEHISA;NAKAI YASUHIDE;KOBELCO RESEARCH INSTITUTE, INC. |
发明人 |
AKAMATSU MASARU;HASHIZUME HIDEHISA;NAKAI YASUHIDE |
分类号 |
H04N7/18 |
主分类号 |
H04N7/18 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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