发明名称 Producing method of wired circuit board
摘要 A producing method of a wired circuit board includes the steps of applying light from above the wired circuit board toward the wired circuit board, and sensing pattern reflected light which is the light reflected by a conductive pattern, table reflected light which is the light reflected by a support table via an insulating layer exposed from the conductive pattern, and foreign-matter reflected light which is the light reflected by a foreign matter present on the insulating layer to inspect the conductive pattern and the foreign matter based on a contrast therebetween. A reflectance of the table reflected light is in a range of 30 to 70%, and a reflectance of the foreign-matter reflected light is in a range of not more than 10%.
申请公布号 US8310668(B2) 申请公布日期 2012.11.13
申请号 US20100656755 申请日期 2010.02.16
申请人 IHARA TERUKAZU;TOYODA YOSHIHIRO;NITTO DENKO CORPORATION 发明人 IHARA TERUKAZU;TOYODA YOSHIHIRO
分类号 G01N21/88;H05K3/00 主分类号 G01N21/88
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