发明名称 |
Integrated circuit packaging system with a component in an encapsulant cavity and method of fabrication thereof |
摘要 |
A method for fabricating an encapsulant cavity integrated circuit package system includes: providing an interposer; forming a first integrated circuit package with an inverted bottom terminal having an encapsulant cavity and the interposer; and attaching a component on the interposer in the encapsulant cavity.
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申请公布号 |
US8309397(B2) |
申请公布日期 |
2012.11.13 |
申请号 |
US201113235755 |
申请日期 |
2011.09.19 |
申请人 |
SHIM IL KWON;HAN BYUNG JOON;RAMAKRISHNA KAMBHAMPATI;CHOW SENG GUAN;STATS CHIPPAC LTD. |
发明人 |
SHIM IL KWON;HAN BYUNG JOON;RAMAKRISHNA KAMBHAMPATI;CHOW SENG GUAN |
分类号 |
H01L21/00;H01L23/02;H05K1/11 |
主分类号 |
H01L21/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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