发明名称 |
Multi-segments modeling bond wire interconnects with 2D simulations in high speed, high density wire bond packages |
摘要 |
A method for modeling bond wires in an IC package for predicting noise effects generated by electromagnetic coupling in complex bond wire configurations. A look-up table of equivalent LC circuit models for the bond wires is generated that accurately predicts the effects of the bond wire circuitry of a signal transmission system. Switch and mirror techniques are applied to reduce the bond wire configurations necessary to simulate. The method includes: setting parameters related to the IC package layout of groups of bond wires; sub-dividing each group of bond wires into regions, each including a portion of the bond wire or its corresponding pad, and generating dissection planes for the regions consisting of the bond wires; performing a 3D simulation on the regions consisting of the corresponding pads, and a 2D simulation for each dissection plane; constructing equivalent circuit models for groups of bond wires and corresponding pads based on the 3D and 2D simulations results; inputting the equivalent circuit models into a circuit simulator to measure the noise effects; and modifying the layout geometry to meet noise targets.
|
申请公布号 |
US8312404(B2) |
申请公布日期 |
2012.11.13 |
申请号 |
US20090492198 |
申请日期 |
2009.06.26 |
申请人 |
HU HAITIAN;BUDELL TIMOTHY W.;CHIU CHARLES S.;TREMBLE ERIC;INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
HU HAITIAN;BUDELL TIMOTHY W.;CHIU CHARLES S.;TREMBLE ERIC |
分类号 |
G06F17/50 |
主分类号 |
G06F17/50 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|